![]() |
½ÃÀ庸°í¼
»óǰÄÚµå
1747704
¼¼°èÀÇ °í¼Ó ÀÎÅÍÄ¿³ØÆ® ½ÃÀåHigh Speed Interconnect |
¼¼°èÀÇ °í¼Ó ÀÎÅÍÄ¿³ØÆ® ½ÃÀåÀº 2030³â±îÁö 5,690¸¸ ´Þ·¯¿¡ À̸¦ Àü¸Á
2024³â¿¡ 3,750¸¸ ´Þ·¯·Î ÃßÁ¤µÇ´Â °í¼Ó ÀÎÅÍÄ¿³ØÆ® ¼¼°è ½ÃÀåÀº 2024-2030³â°£ CAGR 7.2%·Î ¼ºÀåÇÏ¿© 2030³â¿¡´Â 5,690¸¸ ´Þ·¯¿¡ À̸¦ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù. º» º¸°í¼¿¡¼ ºÐ¼®ÇÑ ºÎ¹® Áß ÇϳªÀÎ ´ÙÀÌ·ºÆ® ¾îÅÂÄ¡ ÄÉÀ̺ÒÀº CAGR 8.3%¸¦ ³ªÅ¸³»°í, ºÐ¼® ±â°£ Á¾·á½Ã¿¡´Â 4,030¸¸ ´Þ·¯¿¡ À̸¦ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù. ¾×Ƽºê ±¤ÄÉÀÌºí ºÎ¹®ÀÇ ¼ºÀå·üÀº ºÐ¼® ±â°£¿¡ CAGR 4.7%·Î ÃßÁ¤µÇ°í ÀÖ½À´Ï´Ù.
¹Ì±¹ ½ÃÀåÀº 990¸¸ ´Þ·¯·Î ÃßÁ¤, Áß±¹Àº CAGR 6.9%·Î ¼ºÀå ¿¹Ãø
¹Ì±¹ÀÇ °í¼Ó ÀÎÅÍÄ¿³ØÆ® ½ÃÀåÀº 2024³â¿¡ 990¸¸ ´Þ·¯·Î ÃßÁ¤µË´Ï´Ù. ¼¼°è 2À§ °æÁ¦´ë±¹ÀÎ Áß±¹Àº ºÐ¼® ±â°£ 2024-2030³â°£ CAGR 6.9%·Î ¼ºÀåÀ» Áö¼ÓÇÏ¿©, 2030³â¿¡´Â ¿¹Ãø ½ÃÀå ±Ô¸ð 910¸¸ ´Þ·¯¿¡ À̸¦ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù. ±âŸ ÁÖ¸ñÇØ¾ß ÇÒ Áö¿ªº° ½ÃÀåÀ¸·Î¼´Â ÀϺ»°ú ij³ª´Ù°¡ ÀÖÀ¸¸ç, ºÐ¼® ±â°£Áß CAGRÀº °¢°¢ 6.8%¿Í 6.0%¸¦ º¸ÀÏ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù. À¯·´¿¡¼´Â µ¶ÀÏÀÌ CAGR 5.6%¸¦ º¸ÀÏ Àü¸ÁÀÔ´Ï´Ù.
¼¼°èÀÇ °í¼Ó ÀÎÅÍÄ¿³ØÆ® ½ÃÀå - ÁÖ¿ä µ¿Çâ°ú ÃËÁø¿äÀÎ Á¤¸®
°í¼Ó ÀÎÅÍÄ¿³ØÆ®°¡ Çö´ëÀÇ µ¥ÀÌÅÍ ÀÎÇÁ¶ó¿¡ ÇʼöÀûÀÎ ÀÌÀ¯´Â ¹«¾ùÀΰ¡?
°í¼Ó ÀÎÅÍÄ¿³ØÆ®´Â Ŭ¶ó¿ìµå ÄÄÇ»ÆÃ, AI/ML, ÀÚÀ² ½Ã½ºÅÛ, Åë½Å µî µ¥ÀÌÅÍ Áý¾àÀûÀÎ ºÐ¾ßÀÇ Çõ½Å¿¡ ÀÖ¾î ÇÙ½ÉÀûÀÎ ¿ªÇÒÀ» Çϰí ÀÖ½À´Ï´Ù. µ¥ÀÌÅͼ¾ÅͰ¡ ÃÖ¼ÒÀÇ Áö¿¬½Ã°£À¸·Î ´õ ºü¸¥ ½ÅÈ£ Àü¼ÛÀ» ÇÊ¿ä·Î ÇÏ´Â ¾ÆÅ°ÅØÃ³·Î ÀüȯÇÔ¿¡ µû¶ó, ±âÁ¸ÀÇ ±¸¸®¼± ¹× ·¹°Å½Ã »óÈ£¿¬°áÀº Áõ°¡ÇÏ´Â ´ë¿ªÆø ¼ö¿ä¸¦ ÃæÁ·½Ãų ¼ö Àִ ÷´Ü °í¼Ó ¼Ö·ç¼ÇÀ¸·Î ´ëüµÇ°í ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ »óÈ£ ¿¬°áÀº ÇÁ·Î¼¼¼, ¸Þ¸ð¸® ¸ðµâ, ÁÖº¯ ½Ã½ºÅÛ °£ÀÇ °íÁÖÆÄ ½ÅÈ£ ÀüÆÄ¸¦ À§ÇÑ Áß¿äÇÑ °æ·Î¸¦ Á¦°øÇÏ¿© ¼¹ö, ½ºÅ丮Áö ¾î·¹ÀÌ, ½ºÀ§Ä¡ °£ÀÇ È¿À²ÀûÀÎ ¿öÅ©·Îµå ¿ÀÄɽºÆ®·¹À̼ÇÀ» º¸ÀåÇÕ´Ï´Ù.
ÇÏÀÌÆÛ½ºÄÉÀÏ È¯°æ¿¡¼ÀÇ ³ôÀº 󸮷® ¿ä±¸´Â PCIe Gen5/Gen6, 400G ¹× 800G ÀÌ´õ³Ý, ±×¸®°í °í±Þ InfiniBand ÀÎÅÍÄ¿³ØÆ®ÀÇ Ã¤ÅÃÀ» ÃËÁøÇϰí ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ±â¼úµéÀº AI ¸ðµ¨ ÈÆ·Ã ¹× Ã߷аú °ü·ÃµÈ °í¼º´É ÄÄÇ»ÆÃ(HPC) ¹× ÀúÁö¿¬ ¿öÅ©·Îµå¸¦ Áö¿øÇϵµ·Ï ¼³°èµÇ¾ú½À´Ï´Ù. ÀÌ¿Í ÇÔ²² ¿§Áö ÄÄÇ»ÆÃ°ú 5GÀÇ È®»êÀº ºÐ»êÇü ÄÄÇ»ÆÃ ³ëµå¸¦ Áö¿øÇÏ´Â ¼ÒÇü, ÀúÀü·Â, °í¼ÓÀÇ »óÈ£ ¿¬°á ¼Ö·ç¼Ç¿¡ ´ëÇÑ »õ·Î¿î ¼ö¿ä¸¦ âÃâÇϰí ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ÁøÈ´Â ÀåÄ¡¿Í µ¥ÀÌÅͼ¾ÅÍ °£ÀÇ ¿øÈ°ÇÑ Åë½ÅÀ» °¡´ÉÇÏ°Ô ÇÏ´Â È®Àå °¡´ÉÇϰí, ±¤´ë¿ªÀ̸ç, ¿¡³ÊÁö È¿À²ÀûÀÎ »óÈ£¿¬°áÀ» ÁöÇâÇÏ´Â ±¤¹üÀ§ÇÑ ¾÷°èÀÇ ¿òÁ÷ÀÓÀ» ¹Ý¿µÇϰí ÀÖ½À´Ï´Ù.
Àç·áÀÇ ¹ßÀü°ú ¼³°è Çõ½ÅÀÌ ½ÅÈ£ ¹«°á¼ºÀ» ¾î¶»°Ô Çâ»ó½Ã۰í Àִ°¡?
µ¥ÀÌÅÍ Àü¼Û ¼Óµµ°¡ »¡¶óÁú¼ö·Ï ½ÅÈ£ ¼Õ½Ç, ´©È, ÀüÀڱ⠰£¼·ÀÇ ¿µÇâÀ» ¹Þ±â ½±±â ¶§¹®¿¡ ½ÅÈ£ ¹«°á¼ºÀº ¿©ÀüÈ÷ °í¼Ó ÀÎÅÍÄ¿³ØÆ® ¼³°èÀÇ °¡Àå Áß¿äÇÑ ¹®Á¦ÀÔ´Ï´Ù. ÀÌ ¹®Á¦¸¦ ÇØ°áÇϱâ À§ÇØ Á¦Á¶¾÷ü´Â ÷´Ü PCB Àç·á, Àú¼Õ½Ç À¯Àüü ¹× Â÷µ¿ ½Ö ¾ÆÅ°ÅØÃ³¸¦ »óÈ£ ¿¬°á ¼³°è¿¡ µµÀÔÇϰí ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ Àç·á´Â ÀϰüµÈ ÀÓÇÇ´ø½º Á¦¾î, ¸®ÅÏ ¼Õ½Ç ¼º´É Çâ»ó, ÁöÅÍ °¨¼Ò¸¦ °¡´ÉÇÏ°Ô ÇÕ´Ï´Ù. ¶ÇÇÑ, ÀÌÃà ÄÉÀ̺í, ¾×Ƽºê ±¤ÄÉÀ̺í(AOC), ½Ç¸®ÄÜ Æ÷Åä´Ð½º(Silicon Photonics)ÀÇ »ç¿ëµµ Áõ°¡Çϰí ÀÖÀ¸¸ç, ¿Ö°îÀ» ÃÖ¼ÒÈÇÏ¸é¼ ´õ ±ä °Å¸®¿¡¼ ¿ì¼öÇÑ µ¥ÀÌÅÍ Àü¼Û·üÀ» ´Þ¼ºÇϰí ÀÖ½À´Ï´Ù.
±â°èÀûÀÎ ¼ÒÇüȵµ ÁßÁ¡ »çÇ× Áß ÇϳªÀ̸ç, 25Gbps, 56Gbps, 112GbpsÀÇ ¼Óµµ·Î ¼º´ÉÀ» À¯ÁöÇÏ¸é¼ Ä¿³ØÅÍÀÇ ¼ÒÇüÈ ¹× °í¹ÐµµÈ°¡ ÁøÇàµÇ°í ÀÖ½À´Ï´Ù. ´Ù¿ Á¢Á¡ ½Ã½ºÅÛÀ» °®Ãá ±âÆÇ ´ë ±âÆÇ, ¸ÞÀÚ´Ñ, ¹éÇ÷¹ÀÎ »óÈ£ ¿¬°á µîÀÇ ±â¼ú Çõ½ÅÀº °í¹Ðµµ ÄÄÇ»ÆÃ ½Ã½ºÅÛ¿¡¼ ½ÅÈ£ °æ·Î¸¦ °ü¸®ÇÏ´Â µ¥ µµ¿òÀÌ µÇ°í ÀÖ½À´Ï´Ù. ÇÑÆí, ¿ ¹× EMI ¹®Á¦¸¦ ÁÙÀ̱â À§ÇØ ÀüÀÚ±â Â÷Æó ¹× °í±Þ ¿ ¼ÒÀç°¡ Ä¿³ØÅÍ ÇϿ졿¡ ³»ÀåµÇ¾î ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ±â¼ú Çõ½ÅÀÇ À¶ÇÕÀ» ÅëÇØ °í¼Ó ÀÎÅÍÄ¿³ØÆ®Àº ¼º´ÉÀ̳ª ½Å·Ú¼ºÀ» Èñ»ýÇÏÁö ¾Ê°íµµ Â÷¼¼´ë Çϵå¿þ¾îÀÇ ¿ä±¸ »çÇ×À» ÃæÁ·½Ãų ¼ö ÀÖ½À´Ï´Ù.
Àüü ¿ëµµ ºÎ¹®¿¡¼ ½ÃÀå ¼ö¿ä°¡ °¡¼Óȵǰí ÀÖ´Â ºÐ¾ß´Â ¾îµðÀԴϱî?
µ¥ÀÌÅͼ¾ÅÍ¿Í °í¼º´É ÄÄÇ»ÆÃ ȯ°æÀº Ŭ¶ó¿ìµå ¼ºñ½º È®´ë, AI ¸ðµ¨ È®Àå, ½Ç½Ã°£ ºÐ¼®À¸·Î ÀÎÇØ °í¼Ó ÀÎÅÍÄ¿³ØÆ®ÀÇ °¡Àå Å©°í ºü¸£°Ô ¼ºÀåÇÏ´Â ½ÃÀåÀÔ´Ï´Ù. ±â¾÷µéÀÌ ¿öÅ©·Îµå¸¦ Ŭ¶ó¿ìµå·Î ÀüȯÇÔ¿¡ µû¶ó, ÇÏÀÌÆÛ½ºÄÉÀÏ µ¥ÀÌÅͼ¾ÅÍ´Â ÀúÁö¿¬, °í󸮷® ¿öÅ©·Îµå¸¦ Áö¿øÇÏ´Â °í±Þ ÀÎÅÍÄ¿³ØÆ®·Î ÀÎÇÁ¶ó¸¦ È®ÀåÇϰí ÀÖ½À´Ï´Ù. ¸¶Âù°¡Áö·Î Åë½Å »ç¾÷ÀÚµéÀº Áõ°¡ÇÏ´Â ¹éȦ Æ®·¡ÇȰú Áö¿¬¿¡ Ãë¾àÇÑ 5G ¼ºñ½º¿¡ ´ëÀÀÇϱâ À§ÇØ °í¼Ó ÀÎÅÍÄ¿³ØÆ®¸¦ µµÀÔÇϰí ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ¼Ö·ç¼ÇÀº ½ÅÈ£ ÀúÇϸ¦ ÃÖ¼ÒÈÇÏ¸é¼ ÇÁ·ÐƮȦ, ¹ÌµåȦ, ¹éȦ ¿¬°áÀ» °¡´ÉÇÏ°Ô ÇÏ´Â µ¥ ¸Å¿ì Áß¿äÇÕ´Ï´Ù.
¹Î¼ö¿ë ÀüÀÚ±â±â¿¡¼´Â USB4, Thunderbolt 4, HDMI 2.1 ÀÎÅÍÆäÀ̽ºÀÇ Ã¤ÅÃÀ¸·Î Â÷¼¼´ë ³ëÆ®ºÏ, °ÔÀÓ±â, VR Çìµå¼Â¿¡¼ °í¼Ó µ¥ÀÌÅÍ ¹× ºñµð¿À Àü¼ÛÀÌ °¡´ÉÇØÁö°í ÀÖ½À´Ï´Ù. ÀÚµ¿Â÷ ºÐ¾ß¿¡¼´Â °í¼Ó ÀÎÅÍÄ¿³ØÆ®°¡ ¼¾¼, Ä«¸Þ¶ó, ADAS ÇÁ·Î¼¼¼¸¦ ¿¬°áÇÏ¿© ÀÚÀ²ÁÖÇàÂ÷ ¹× Ä¿³ØÆ¼µåÄ«ÀÇ ºÎ»óÀ» µÞ¹ÞħÇϰí ÀÖ½À´Ï´Ù. ¶ÇÇÑ, »ê¾÷ ÀÚµ¿È ¹× ·Îº¿ °øÇÐ ºÐ¾ß¿¡¼´Â ¿¾ÇÇÑ È¯°æ¿¡¼ ½Ç½Ã°£ Á¦¾î ¹× ¸ð´ÏÅ͸µ µ¥ÀÌÅ͸¦ °ü¸®Çϱâ À§ÇØ °·ÂÇÑ °í¼Ó ÀÎÅÍÄ¿³ØÆ®°¡ Ȱ¿ëµÇ°í ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ »õ·Î¿î ¿ëµµ´Â ÀÌ¿ë »ç·Ê¸¦ ´Ù¾çÈÇÏ¿© ºÐ¾ßº° ¿ä±¸¿¡ ÃÖÀûÈµÈ ¸ÂÃãÇü »óÈ£¿¬°á ¼Ö·ç¼ÇÀ» ÃËÁøÇϰí ÀÖ½À´Ï´Ù.
°í¼Ó ÀÎÅÍÄ¿³ØÆ® ½ÃÀåÀÇ ¼ºÀåÀº ¸î °¡Áö ¿äÀο¡ ÀÇÇØ ÃËÁøµË´Ï´Ù.
¼¼°è µ¥ÀÌÅÍ Æ®·¡ÇÈÀÇ ±Þ°ÝÇÑ Áõ°¡, AI·Î ÀÎÇÑ ¿öÅ©·ÎµåÀÇ º¹À⼺ Áõ°¡, Áö¿¬¿¡ ¹Î°¨ÇÑ ¿ëµµÀÇ ±ÞÁõ µîÀÌ ÀÌ ½ÃÀåÀ» °ßÀÎÇϰí ÀÖ½À´Ï´Ù. Ŭ¶ó¿ìµå ¹× ÇÏÀÌÆÛ½ºÄÉÀÏ µ¥ÀÌÅͼ¾ÅÍ¿¡¼´Â 400G/800G ³×Æ®¿öÅ© ¾ÆÅ°ÅØÃ³¿Í PCIe Gen5/6 ÀÎÅÍÆäÀ̽ºÀÇ Ã¤ÅÃÀÌ È®´ëµÇ°í ÀÖÀ¸¸ç, ÀÌ´Â ¼ö¿ä¸¦ Å©°Ô Áõ°¡½Ã۰í ÀÖ½À´Ï´Ù. µ¿½Ã¿¡ 5G ÀÎÇÁ¶óÀÇ ±¸ÃàÀ¸·Î ÄÚ¾î ¹× ¿§Áö ³×Æ®¿öÅ© ¸ðµÎ¿¡¼ ÀúÁö¿¬, ±¤´ë¿ª »óÈ£ ¿¬°á¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡Çϰí ÀÖÀ¸¸ç, CPU, GPU, Àü¿ë °¡¼Ó±â¸¦ °áÇÕÇÑ À̱âÁ¾ ÄÄÇ»ÆÃÀÇ µîÀåÀ¸·Î °í¼Ó µð¹ÙÀ̽º °£ ¿¬°á¿¡ ´ëÇÑ Çʿ伺ÀÌ Áõ°¡Çϰí ÀÖ½À´Ï´Ù. Çʿ伺ÀÌ ³ô¾ÆÁö°í ÀÖ½À´Ï´Ù.
ºÎǰ ·¹º§¿¡¼´Â °í¼Ó ½ÅÈ£ ÇÁ·ÎÅäÄÝ, ¾×Ƽºê ÄÉÀÌºí ±â¼ú, ½Ç¸®ÄÜ Æ÷Åä´Ð½ºÀÇ ¹ßÀüÀ¸·Î »óÈ£ ¿¬°áÀÇ °í¼ÓÈ, °æ·®È, ¿¡³ÊÁö È¿À²¼ºÀÌ Çâ»óµÇ°í ÀÖÀ¸¸ç, AI Æ®·¹ÀÌ´× Å¬·¯½ºÅÍ ¹× ´ë±Ô¸ð ¾ð¾î ¸ðµ¨ ÀÎÇÁ¶ó¿¡ ´ëÇÑ ÅõÀÚ È®´ë·Î ÀÎÇØ ÃÊ °í¹Ðµµ ·¹À̾ƿô¿¡¼ ½ÅÈ£ ¹«°á¼ºÀ» À¯ÁöÇÒ ¼ö ÀÖ´Â »óÈ£ ¿¬°á¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡Çϰí ÀÖ½À´Ï´Ù. ÀÌ¿Í ÇÔ²² Â÷·®¿ë ÀÌ´õ³Ý, °í¼Ó USB, RF ÀÎÅÍÄ¿³Ø¼ÇÀÇ ½ÅÁ¦Ç° °³¹ßÀÌ ÁøÇàµÇ¸é¼ ½ÃÀå °³Ã´Àº µ¥ÀÌÅͼ¾ÅÍ ¿Ü¿¡µµ È®´ëµÇ°í ÀÖ½À´Ï´Ù. °í´ë¿ªÆø, ¿¡³ÊÁö ÃÖÀûÈ, ¼ÒÇü ½Ã½ºÅÛ ¼³°èÀÇ À¶ÇÕÀ¸·Î °í¼Ó ÀÎÅÍÄ¿³ØÆ®ÀÇ ¿ªÇÒÀº ¾÷°è Àü¹Ý¿¡ °ÉÃÄ È®°íÈ÷ ÀÚ¸® Àâ°í ÀÖ½À´Ï´Ù.
ºÎ¹®
À¯Çü(´ÙÀÌ·ºÆ® ¾îÅÂÄ¡ ÄÉÀ̺Ò, ¾×Ƽºê ±¤ÄÉÀ̺í), ¿ëµµ(µ¥ÀÌÅͼ¾ÅÍ, ÅÚ·¹ÄÞ, ¼ÒºñÀÚ ÀÏ·ºÆ®·Î´Ð½º, ³×Æ®¿öÅ·£¦ÄÄÇ»ÆÃ, ±âŸ Ȱµ¿)
°ü¼¼ ¿µÇâ °è¼ö
Global Industry Analysts´Â º»±¹, Á¦Á¶±âÁö, ¼öÃâÀÔ(¿ÏÁ¦Ç° ¹× OEM)À» ±â¹ÝÀ¸·Î ±â¾÷ÀÇ °æÀï·Â º¯È¸¦ ¿¹ÃøÇϰí ÀÖÀ¸¸ç, ´ç»çÀÇ »õ·Î¿î ¸±¸®½º´Â Áö¸®Àû ½ÃÀå¿¡ ´ëÇÑ °ü¼¼ÀÇ ¿µÇâÀ» ÅëÇÕÇϰí ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ º¹ÀâÇÏ°í ´Ù¸éÀûÀÎ ½ÃÀå ¿ªÇÐÀº ÀÎÀ§ÀûÀÎ ÆÇ¸Å ºñ¿ë Áõ°¡, ¼öÀͼº °¨¼Ò, °ø±Þ¸Á À籸¼º µî ¹Ì½ÃÀû ¹× °Å½ÃÀû ½ÃÀå ¿ªÇÐ Áß¿¡¼µµ ƯÈ÷ °æÀï»ç¿¡ ¿µÇâÀ» ¹ÌÄ¥ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù.
Global Industry Analysts´Â ¼¼°è ÁÖ¿ä ¼ö¼® ÀÌÄÚ³ë¹Ì½ºÆ®(1,4,949¸í), ½ÌÅ©ÅÊÅ©(62°³ ±â°ü), ¹«¿ª ¹× »ê¾÷ ´Üü(171°³ ±â°ü)ÀÇ Àü¹®°¡µéÀÇ ÀǰßÀ» ¸é¹ÐÈ÷ °ËÅäÇÏ¿© »ýŰ迡 ¹ÌÄ¡´Â ¿µÇâÀ» Æò°¡ÇÏ°í »õ·Î¿î ½ÃÀå Çö½Ç¿¡ ´ëÀÀÇϰí ÀÖ½À´Ï´Ù. ¸ðµç ÁÖ¿ä ±¹°¡ÀÇ Àü¹®°¡¿Í °æÁ¦ÇÐÀÚµéÀÌ °ü¼¼¿Í ±×°ÍÀÌ ÀÚ±¹¿¡ ¹ÌÄ¡´Â ¿µÇâ¿¡ ´ëÇÑ ÀǰßÀ» ÃßÀû Á¶»çÇß½À´Ï´Ù.
Global Industry Analysts´Â ÀÌ·¯ÇÑ È¥¶õÀÌ ÇâÈÄ 2-3°³¿ù ³»¿¡ ¸¶¹«¸®µÇ°í »õ·Î¿î ¼¼°è Áú¼°¡ º¸´Ù ¸íÈ®ÇÏ°Ô È®¸³µÉ °ÍÀ¸·Î ¿¹»óÇϰí ÀÖÀ¸¸ç, Global Industry Analysts´Â ÀÌ·¯ÇÑ »óȲÀ» ½Ç½Ã°£À¸·Î ÃßÀûÇϰí ÀÖ½À´Ï´Ù.
2025³â 4¿ù: Çù»ó ´Ü°è
À̹ø 4¿ù º¸°í¼¿¡¼´Â °ü¼¼°¡ ¼¼°è ½ÃÀå Àüü¿¡ ¹ÌÄ¡´Â ¿µÇâ°ú Áö¿ªº° ½ÃÀå Á¶Á¤¿¡ ´ëÇØ ¼Ò°³ÇÕ´Ï´Ù. ´ç»çÀÇ ¿¹ÃøÀº °ú°Å µ¥ÀÌÅÍ¿Í ÁøÈÇÏ´Â ½ÃÀå ¿µÇâ¿äÀÎÀ» ±â¹ÝÀ¸·Î ÇÕ´Ï´Ù.
2025³â 7¿ù: ÃÖÁ¾ °ü¼¼ Àç¼³Á¤
°í°´´Ôµé²²´Â °¢ ±¹°¡º° ÃÖÁ¾ ¸®¼ÂÀÌ ¹ßÇ¥µÈ ÈÄ 7¿ù¿¡ ¹«·á ¾÷µ¥ÀÌÆ® ¹öÀüÀ» Á¦°øÇØ µå¸³´Ï´Ù. ÃÖÁ¾ ¾÷µ¥ÀÌÆ® ¹öÀü¿¡´Â ¸íÈ®ÇÏ°Ô Á¤ÀÇµÈ °ü¼¼ ¿µÇ⠺м®ÀÌ Æ÷ÇԵǾî ÀÖ½À´Ï´Ù.
»óÈ£ ¹× ¾çÀÚ °£ ¹«¿ª°ú °ü¼¼ÀÇ ¿µÇ⠺м® :
¹Ì±¹ <>& Áß±¹ <>& ¸ß½ÃÄÚ <>& ij³ª´Ù <>&EU <>& ÀϺ» <>& Àεµ <>& ±âŸ 176°³±¹
¾÷°è ÃÖ°íÀÇ ÀÌÄÚ³ë¹Ì½ºÆ®: Global Industry AnalystsÀÇ Áö½Ä ±â¹ÝÀº ±¹°¡, ½ÌÅ©ÅÊÅ©, ¹«¿ª ¹× »ê¾÷ ´Üü, ´ë±â¾÷, ±×¸®°í ¼¼°è °è·® °æÁ¦ »óȲÀÇ Àü·Ê ¾ø´Â ÆÐ·¯´ÙÀÓ ÀüȯÀÇ ¿µÇâÀ» °øÀ¯ÇÏ´Â ºÐ¾ßº° Àü¹®°¡ µî °¡Àå ¿µÇâ·Â ÀÖ´Â ¼ö¼® ÀÌÄÚ³ë¹Ì½ºÆ® ±×·ìÀ» Æ÷ÇÔÇÑ 14,949¸íÀÇ ÀÌÄÚ³ë¹Ì½ºÆ®¸¦ ÃßÀûÇϰí ÀÖ½À´Ï´Ù. 16,491°³ ÀÌ»óÀÇ º¸°í¼ ´ëºÎºÐ¿¡ ¸¶ÀϽºÅæ¿¡ ±â¹ÝÇÑ 2´Ü°è Ãâ½Ã ÀÏÁ¤ÀÌ Àû¿ëµÇ¾î ÀÖ½À´Ï´Ù.
Global High Speed Interconnect Market to Reach US$56.9 Million by 2030
The global market for High Speed Interconnect estimated at US$37.5 Million in the year 2024, is expected to reach US$56.9 Million by 2030, growing at a CAGR of 7.2% over the analysis period 2024-2030. Direct Attach Cable, one of the segments analyzed in the report, is expected to record a 8.3% CAGR and reach US$40.3 Million by the end of the analysis period. Growth in the Active Optical Cable segment is estimated at 4.7% CAGR over the analysis period.
The U.S. Market is Estimated at US$9.9 Million While China is Forecast to Grow at 6.9% CAGR
The High Speed Interconnect market in the U.S. is estimated at US$9.9 Million in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$9.1 Million by the year 2030 trailing a CAGR of 6.9% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 6.8% and 6.0% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 5.6% CAGR.
Global High Speed Interconnect Market - Key Trends & Drivers Summarized
Why Are High Speed Interconnects Becoming Essential for Modern Data Infrastructure?
High speed interconnects are playing a foundational role in the transformation of data-intensive sectors including cloud computing, AI/ML, autonomous systems, and telecommunications. As data centers transition to architectures that require faster signal transmission with minimal latency, traditional copper and legacy interconnects are being replaced with advanced high-speed solutions capable of handling increasing bandwidth demands. These interconnects provide the critical pathways for high-frequency signal propagation between processors, memory modules, and peripheral systems, ensuring efficient workload orchestration across servers, storage arrays, and switches.
The need for higher throughput in hyperscale environments is driving the adoption of PCIe Gen5/Gen6, 400G and 800G Ethernet, and advanced InfiniBand interconnects. These technologies are designed to support high-performance computing (HPC) and low-latency workloads associated with AI model training and inference. In parallel, edge computing and 5G deployment are creating new demand for compact, low-power, and high-speed interconnect solutions to support decentralized computing nodes. This evolution reflects a broader industry push toward scalable, high-bandwidth, energy-efficient interconnects that can enable seamless communication across devices and data centers.
How Are Material Advancements and Design Innovations Enhancing Signal Integrity?
Signal integrity remains a top concern in high speed interconnect design, as higher data rates increase susceptibility to signal loss, crosstalk, and electromagnetic interference. To address this, manufacturers are incorporating advanced PCB materials, low-loss dielectrics, and differential pair architectures into interconnect designs. These materials enable consistent impedance control, improved return loss performance, and reduced jitter. In addition, the use of twinaxial cables, active optical cables (AOCs), and silicon photonics is rising, offering superior data rates over longer distances with minimal distortion.
Mechanical miniaturization is another focal area, with connectors becoming smaller and denser while maintaining performance at 25Gbps, 56Gbps, and 112Gbps speeds. Innovations such as board-to-board, mezzanine, and backplane interconnects with multi-row contact systems are helping to manage signal paths in dense computing systems. Meanwhile, electromagnetic shielding and advanced thermal materials are being integrated into connector housings to mitigate heat and EMI issues. The convergence of these innovations is enabling high speed interconnects to meet the demands of next-generation hardware without sacrificing performance or reliability.
Where Is Market Demand Accelerating Across Application Segments?
Data centers and high-performance computing environments represent the largest and fastest-growing markets for high speed interconnects, driven by cloud service expansion, AI model scaling, and real-time analytics. As enterprises migrate workloads to the cloud, hyperscale data centers are scaling up infrastructure with advanced interconnects to support low-latency, high-throughput workloads. Similarly, telecom operators are deploying high-speed interconnects to handle rising backhaul traffic and latency-sensitive 5G services. These solutions are critical in enabling fronthaul, midhaul, and backhaul connectivity with minimal signal degradation.
In consumer electronics, the adoption of USB4, Thunderbolt 4, and HDMI 2.1 interfaces is enabling high-speed data and video transmission across next-gen laptops, gaming consoles, and VR headsets. In the automotive domain, high-speed interconnects are supporting the rise of autonomous and connected vehicles by linking sensors, cameras, and ADAS processors. Additionally, industrial automation and robotics are leveraging ruggedized high-speed interconnects to manage real-time control and monitoring data in harsh environments. These emerging applications are diversifying the use cases and driving customized interconnect solutions optimized for sector-specific needs.
The Growth in the High Speed Interconnect Market Is Driven by Several Factors…
It is propelled by the exponential increase in global data traffic, AI-driven workload complexity, and the proliferation of latency-sensitive applications. The growing adoption of 400G/800G network architectures and PCIe Gen5/6 interfaces in cloud and hyperscale data centers is significantly boosting demand. Simultaneously, the rollout of 5G infrastructure is generating demand for low-latency, high-bandwidth interconnects in both core and edge networks. The rise of heterogeneous computing-featuring combinations of CPUs, GPUs, and specialized accelerators-is also driving the need for high-speed inter-device connectivity.
On the component level, advancements in high-speed signaling protocols, active cable technologies, and silicon photonics are making interconnects faster, lighter, and more energy efficient. Growing investment in AI training clusters and large language model infrastructure is intensifying the demand for interconnects that can maintain signal integrity over ultra-dense layouts. In parallel, new product development for automotive Ethernet, high-speed USB, and RF interconnects is expanding market coverage beyond data centers. The convergence of high bandwidth, energy optimization, and compact system design is solidifying the role of high speed interconnects across industries.
SCOPE OF STUDY:
The report analyzes the High Speed Interconnect market in terms of units by the following Segments, and Geographic Regions/Countries:
Segments:
Type (Direct Attach Cable, Active Optical Cable); Application (Data Centers, Telecom, Consumer Electronics, Networking & Computing, Other Applications)
Geographic Regions/Countries:
World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.
Select Competitors (Total 39 Featured) -
TARIFF IMPACT FACTOR
Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by artificially increasing the COGS, reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.
We are diligently following expert opinions of leading Chief Economists (14,949), Think Tanks (62), Trade & Industry bodies (171) worldwide, as they assess impact and address new market realities for their ecosystems. Experts and economists from every major country are tracked for their opinions on tariffs and how they will impact their countries.
We expect this chaos to play out over the next 2-3 months and a new world order is established with more clarity. We are tracking these developments on a real time basis.
As we release this report, U.S. Trade Representatives are pushing their counterparts in 183 countries for an early closure to bilateral tariff negotiations. Most of the major trading partners also have initiated trade agreements with other key trading nations, outside of those in the works with the United States. We are tracking such secondary fallouts as supply chains shift.
To our valued clients, we say, we have your back. We will present a simplified market reassessment by incorporating these changes!
APRIL 2025: NEGOTIATION PHASE
Our April release addresses the impact of tariffs on the overall global market and presents market adjustments by geography. Our trajectories are based on historic data and evolving market impacting factors.
JULY 2025 FINAL TARIFF RESET
Complimentary Update: Our clients will also receive a complimentary update in July after a final reset is announced between nations. The final updated version incorporates clearly defined Tariff Impact Analyses.
Reciprocal and Bilateral Trade & Tariff Impact Analyses:
USA <> CHINA <> MEXICO <> CANADA <> EU <> JAPAN <> INDIA <> 176 OTHER COUNTRIES.
Leading Economists - Our knowledge base tracks 14,949 economists including a select group of most influential Chief Economists of nations, think tanks, trade and industry bodies, big enterprises, and domain experts who are sharing views on the fallout of this unprecedented paradigm shift in the global econometric landscape. Most of our 16,491+ reports have incorporated this two-stage release schedule based on milestones.
COMPLIMENTARY PREVIEW
Contact your sales agent to request an online 300+ page complimentary preview of this research project. Our preview will present full stack sources, and validated domain expert data transcripts. Deep dive into our interactive data-driven online platform.